Digit Concept SLP500 Laser Decapsulation

•After 15 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …).

•The SLP500DC is based on our SL500DC platform.  It combines a high performance IR Fiber LASER with an Atmospheric Plasma Assisted to avoid corrosion.This SLP is based on our joint patent with the CNES Toulouse (Fr) – WO 2008/090281.

•3 in 1 system: The SLP500 allows to perform IC decapsulator, PCB cutting(*1) , samples cross-section(*1)

•Flexible and Reliable : The SLP50 integrates a 10W IR Fiber LASER on basis. Laser or Lens upgrades are available to meet all you requirements. The SLP500 is equipped with a Live vision camera with Fast Z adjustment and a Coaxial camera with High Mag and FOV on request.

•Easy and Safe: The SLP500 is a compact system, very easy to move. It can be installed everywhere in a workshop or on a production line and  needs a simple mono-phased electric plug 110/220V – 50/60Hz. Plug it, you are ready to start

•Many Options available: More power needed, Multipulse LASER …